Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Ein praxisorientiertes Werk, das die neuesten Techniken des Embedded‑ und Fan‑Out‑Wafer‑Level‑Packings beleuchtet; es führt durch Prozesssc ...
Packaging Technologies
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Hugendubel
174.49 EUR
Preis aktualisiert am: 28-08-2024 19:24:45
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ISBN
1119314135

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