Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics, 30, Band 30)

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Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics, 30, Band 30)

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Advanced Materials for Thermal Management of Electronic Packaging

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295.00 EUR

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Tong, Xingcun Colin

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Tong, Xingcun Colin 1441977589

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