Wafer-Level Integrated Systems: Implementation Issues (The Springer International Series in Engineering and Computer Science, 70, Band 70)

Wo zu kaufen (3) Eigenschaften
Gesponsert
Wafer-Level Integrated Systems: Implementation Issues (The Springer International Series in Engineering and Computer Science, 70, Band 70)
Medimops DE
149.84 EUR
Preis aktualisiert am: 09-11-2026 18:26:13
Siehe Produktangebot
Gesponsert
Wafer-Level Integrated Systems
Hugendubel
160.49 EUR
Preis aktualisiert am: 07-11-2026 11:14:41
Siehe Produktangebot
Gesponsert
Wafer-Level Integrated Systems
SpringerLink DE
177.00 EUR
Preis aktualisiert am: 09-11-2026 12:42:39
Siehe Produktangebot

Allgemein

Marke
Tewksbury, Stuart K.
ISBN
Tewksbury, Stuart K. 1461288983
MPN
Tewksbury, Stuart K. biography

Eigenschaften

Ähnliche Produkte

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)
Aus139.24 EUR 4
Produkt anzeigen
Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Aus149.84 EUR 2
Produkt anzeigen
Wafer-Level Testing and Test During Burn-In for Integrated Circuits
Wafer-Level Testing and Test During Burn-In for Integrated Circuits
Aus95.99 EUR 1
Produkt anzeigen
Wafer Level 3-D ICS Process Technology
Wafer Level 3-D ICS Process Technology
Aus177.00 EUR 1
Produkt anzeigen
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Aus177.00 EUR 1
Produkt anzeigen
Wafer-Level Chip-Scale Packaging
Wafer-Level Chip-Scale Packaging
Aus175.99 EUR 1
Produkt anzeigen
Menü