Thermal Stress and Strain in Microelectronics Packaging

And Strain in Microelectronics
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Thermal Stress and Strain in Microelectronics Packaging
Medimops DE
138.98 EUR
Preis aktualisiert am: 20-06-2026 02:57:24
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Thermal Stress and Strain in Microelectronics Packaging
preigu.de
140.95 EUR
Preis aktualisiert am: 20-06-2026 03:04:30
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Thermal Stress and Strain in Microelectronics Packaging
SpringerLink DE
160.49 EUR
Preis aktualisiert am: 19-06-2026 19:17:17
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Thermal Stress and Strain in Microelectronics Packaging, Fachbücher von John Lau
Galaxus.de
160.49 EUR
Preis aktualisiert am: 23-06-2026 21:23:59
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Allgemein

Marke
John Lau
ISBN
John Lau 1468477692
MPN
John Lau 466 black & white illustrations

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