Thermal Stress and Strain in Microelectronics Packaging

And Strain in Microelectronics
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Thermal Stress and Strain in Microelectronics Packaging
Medimops DE
138.98 EUR
Preis aktualisiert am: 09-11-2026 18:52:36
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Thermal Stress and Strain in Microelectronics Packaging
Hugendubel
160.49 EUR
Preis aktualisiert am: 10-11-2026 17:20:49
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Thermal Stress and Strain in Microelectronics Packaging
SpringerLink DE
160.49 EUR
Preis aktualisiert am: 12-11-2026 06:29:54
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Allgemein

Marke
John Lau
ISBN
John Lau 1468477692
MPN
John Lau 466 black & white illustrations

Eigenschaften

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