Thermal Stress and Strain in Microelectronics Packaging

And Strain in Microelectronics
Wo zu kaufen (3) Eigenschaften
Gesponsert
Thermal Stress and Strain in Microelectronics Packaging
Medimops DE
138.98 EUR
Preis aktualisiert am: 08-08-2026 19:16:23
Siehe Produktangebot
Gesponsert
Thermal Stress and Strain in Microelectronics Packaging
preigu.de
140.95 EUR
Preis aktualisiert am: 09-08-2026 08:53:01
Siehe Produktangebot
Gesponsert
Thermal Stress and Strain in Microelectronics Packaging
SpringerLink DE
177.00 EUR
Preis aktualisiert am: 09-08-2026 11:11:33
Siehe Produktangebot

Allgemein

Marke
John Lau
ISBN
John Lau 1468477692
MPN
John Lau 466 black & white illustrations

Eigenschaften

Ähnliche Produkte

Theory of Elasticity and Thermal Stresses: Explanations, Problems and Solutions (Solid Mechanics and Its Applications, Band 197)
Theory of Elasticity and Thermal Stresses: Explanations, Problems and Solutions (Solid Mechanics and Its Applications, Band 197)
Produkt anzeigen
Thermal Stresses―Advanced Theory and Applications (Solid Mechanics and Its Applications, 158, Band 158)
Thermal Stresses―Advanced Theory and Applications (Solid Mechanics and Its Applications, 158, Band 158)
Produkt anzeigen
Laser Pulse Heating of Surfaces and Thermal Stress Analysis
Laser Pulse Heating of Surfaces and Thermal Stress Analysis
Produkt anzeigen
Eslami, M: Theory of Elasticity and Thermal Stresses
Eslami, M: Theory of Elasticity and Thermal Stresses
Produkt anzeigen
Thermal Stress and Strain Generation in Heat Treatment (Scripta Humanistica; 48)
Thermal Stress and Strain Generation in Heat Treatment (Scripta Humanistica; 48)
Produkt anzeigen
Residual Stresses and Thermal Fatigue in Metal Matrix Composites: A comparative study of stress measurements by neutron and synchrotron diffraction combined with tomography
Residual Stresses and Thermal Fatigue in Metal Matrix Composites: A comparative study of stress measurements by neutron and synchrotron diffraction combined with tomography
Produkt anzeigen
Menü