Interconnect Reliability in Advanced Memory Device Packaging (Springer Series in Reliability Engineering)

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Interconnect Reliability in Advanced Memory Device Packaging (Springer Series in Reliability Engineering)
Medimops DE
196.44 EUR
Preis aktualisiert am: 26-09-2026 09:54:16
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Interconnect Reliability in Advanced Memory Device Packaging
SpringerLink DE
213.99 EUR
Preis aktualisiert am: 26-09-2026 07:42:15
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Gan:Interconnect Reliability in Advance, Fachbücher von Chong Leong Gan, Chen-Yu Huang
Galaxus.de
213.99 EUR
Preis aktualisiert am: 23-09-2026 10:09:25
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Gan, Chong Leong

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