Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

Das Werk beleuchtet die Zusammensetzung und das Verhalten von Kupfer‑Freien Lötverbindungen, analysiert deren Mikrostruktur sowie die Belastbarkeit ...
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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
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Springer-Verlag GmbH
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Springer-Verlag GmbH 81 black & white illustrations, 34 colou
ISBN
Springer-Verlag GmbH 9783662488218

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