Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Entwickelt für Fachleute im Halbleiterbau bietet dieses Buch eine tiefgehende Analyse der chemisch-mechanischen Polierung von neuartigen Ru-Diffusion ...
Research on Chemical Mechanical
Wo zu kaufen (2) Eigenschaften
Gesponsert
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec, Fachbücher von Jie Cheng
Galaxus.de
106.99 EUR
Preis aktualisiert am: 06-09-2026 08:09:13
Siehe Produktangebot
Gesponsert
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
SpringerLink DE
118.00 EUR
Preis aktualisiert am: 07-09-2026 11:22:42
Siehe Produktangebot

Allgemein

Marke
Springer
ISBN
Springer 9811355851

Eigenschaften

Ähnliche Produkte

Chemical Research on Plant Growth: A translation of Théodore de Saussure's Recherches chimiques sur la Végétation by Jane F. Hill
Chemical Research on Plant Growth: A translation of Théodore de Saussure's Recherches chimiques sur la Végétation by Jane F. Hill
Produkt anzeigen
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Produkt anzeigen
Reverse Osmosis Membrane Research: Based on the symposium on “Polymers for Desalination” held at the 162nd National Meeting of the American Chemical Society in Washington, D.C., September 1971
Reverse Osmosis Membrane Research: Based on the symposium on “Polymers for Desalination” held at the 162nd National Meeting of the American Chemical Society in Washington, D.C., September 1971
Produkt anzeigen
Chemical Research on Plant Growth: A translation of Théodore de Saussure's Recherches chimiques sur la Végétation by Jane F. Hill
Chemical Research on Plant Growth: A translation of Théodore de Saussure's Recherches chimiques sur la Végétation by Jane F. Hill
Produkt anzeigen
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Produkt anzeigen
The History of Research on Chemical Periodic Processes (SpringerBriefs in History of Science and Technology)
The History of Research on Chemical Periodic Processes (SpringerBriefs in History of Science and Technology)
Produkt anzeigen
Menü