The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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106.99 EUR
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Marke
Gerard Kelly
ISBN
Gerard Kelly 9780792384854

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