The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, Fachbücher
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Medimops DE
106.99 EUR
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
SpringerLink DE
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Allgemein

Marke
Gerard Kelly
ISBN
Gerard Kelly 1461372763
MPN
Gerard Kelly biography

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