Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009

And Reliability for Advanced
Wo zu kaufen (1) Eigenschaften
Gesponsert
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ― 2009: Volume 1156 (MRS Proceedings, Band 1156)
Medimops DE
127.80 EUR
Preis aktualisiert am: 20-06-2026 03:14:57
Siehe Produktangebot

Allgemein

Marke
Cambridge University Press

Eigenschaften

Ähnliche Produkte

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Produkt anzeigen
Materials and Processes: for Spacecraft and High Reliability Applications (Springer Praxis Books)
Materials and Processes: for Spacecraft and High Reliability Applications (Springer Praxis Books)
Produkt anzeigen
D. Dunn, Barrie: Materials and Processes
D. Dunn, Barrie: Materials and Processes
Produkt anzeigen
Silver Metallization: Stability and Reliability (Engineering Materials and Processes)
Silver Metallization: Stability and Reliability (Engineering Materials and Processes)
Produkt anzeigen
Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics
Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Produkt anzeigen
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 1012, 2007, San ... Held April 10 12, 20 (MRS Proceedings)
Produkt anzeigen
Menü